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ANSYS Products-2021 R2-多国语言-[Windows]

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破解说明见_SolidSQUAD_目录下的readme_local_crack_ssq.txt文件

Ansys 2021 R2: Ansys Maxwell Update
The 2021 R2 Ansys Maxwell release introduces significant improvements in low frequency simulation capabilities and numerous multiphysics enhancements that extend NVH to broader applications including better and faster 2D skew design modeling and the A-phi solver.

Ansys 2021 R2: Ansys HFSS Update
With 2021 R2 Ansys HFSS continues to bring groundbreaking technologies to address PCB and 3D-IC package design challenges as well as advancements in antenna design. On the heels of Ansys HFSS Mesh Fusion Ansys HFSS Phi Plus meshing features enable unrivaled speed and robustness for solving 3D-IC package challenges especially geometries like wire bond-type packages.

Ansys 2021 R2: Ansys Fluent Update
The 2021 R2 release introduces significant improvements for hypersonic and high-speed flow applications like 5X solver speed-ups ablation modeling and much more.

Ansys 2021 R2: What\s New in Ansys Minerva Powered by Aras
In release 2021 R2 Ansys Minerva enhances collaboration with custom dashboards that communicate relevant information efficiently among teams and ships a host of sleek and rich UI enhancements that greatly improve engineering productivity. This release brings enhanced integration between Ansys optiSLang and Ansys Minerva democratizing simulation automation with just a few clicks which enables experts and nonexperts to reap the benefits of simulation.

Ansys 2021 R2: Ansys Lumerical Update
With the 2021 R2 release Ansys continues to push the innovation envelope for its Ansys Lumerical photonics products delivering powerful new capabilities for improved accuracy performance and usability. The 2021 R2 release includes:
– Improvements to Lumerical MQW gain solver (model for excitons enables EAM simulation MQW solver object in finite-element IDE allows simulation setup and run from GUI material model added to electrical and thermal material database in finite-element IDE).
– Ansys Lumerical FDTD Ansys Lumerical MODE and Ansys Lumerical INTERCONNECT support Touchstone format for optical S-parameter export/import.
– PML boundary condition in FEEM.
– Ansys SPEOS – Lumerical workflows for display design.
– Ansys OptiSLang – Lumerical integration for multiphysics simulation workflows and optimization of photonic components.
– Ansys Lumerical CML Compiler improvements (new models for both INTERCONNECT and photonic Verilog-A).

Ansys 2021 R2: Safety Analysis Update
In Ansys 2021 R2 Ansys medini analyze dramatically decreases analysis efforts with efficient application of safety reliability and cybersecurity analysis methods and tight integrations to widely used engineering tools.

Ansys 2021 R2: Signal and Power Integrity Update
The 2021 R2 Signal and Power Integrity release introduces significant simulation improvements for electronic printed circuit boards and IC packages. Ansys SIwave delivers new features including support for temperature-dependent materials in AC solver and an updated thermal link between Ansys Icepak and Ansys Electronics Desktop. Additionally SI Xplorer will help PCB designers define stackup and optimize transitions such as vias.

Ansys 2021 R2: What\s New in Ansys Granta MI
The 2021 R2 version of Ansys Granta MI significantly improves productivity for design simulation and materials engineers. Granta MI now features easier access and consumption of core trusted materials data through an improved UI and deeper integrations with a range of different engineering tools.

Ansys 2021 R2: Advancing Photonics with Lumerical and OptiSLang
With the addition of Ansys Lumerical into the Ansys family users can run multiphysics simulations of photonic components by combining Lumerical solvers with other Ansys solvers. The new Lumerical integration in Ansys OptiSLang makes this easier enabling photonic component and circuit designers to benefit from the process integration and design optimization solution offered by OptiSLang.

Ansys 2021 R2: What’s New with Ansys VRXPERIENCE Sound
Highlights include using the Sound Composer to generate evolving broadband noise such as the interior car sound in acceleration or deceleration and easy access and data transfer to other Ansys solvers.

Ansys 2021 R2: What’s New with Ansys Mechanical
Highlights include unlimited modeling possibilities with journaling and scripting in the Mechanical interface and increased meshing efficiency and quality for shell meshing among many others.

Ansys 2021 R2: Enhancements in Ansys Twin Builder Deployment Workflow
Ansys Twin Builder 2021 R2 continues to transform your operations with data-driven and simulation-based digital twins. New release includes powerful enhancements and new features in deployment workflow that allow users to easily build validate and deploy digital twins.

Ansys 2021 R2: Hypersonic and High-Speed Flows Update
In latest release added new advancements in hypersonic and high-speed flow applications like 5X solver speed-ups ablation modeling and much more:
– Up to 5X speed-ups for high-speed flows to Mach 30 and above with improved treatment of reaction sources in the density-based solver.
– Built-in thermodynamic non-equilibrium effects.
– NASA-9 coefficient material properties.
– Partial slip-wall model for rarefied flows.
– A new built-in workflow for wall recession to model surface ablation.

Ansys 2021 R2: What\s New in Ansys optiSLang
In release 2021 R2 Ansys optiSLang adds flexibility and accessibility with a new packaging model that includes premium and enterprise license options. optiSLang accelerates innovation through tighter integrations with Ansys Electronics Desktop and Ansys Workbench enabling engineers to leverage the power of optiSLang directly from the solvers.

Ansys 2021 R2: What’s New in Ansys Icepak
2021 R2 introduces significant improvements to electronics thermal management analyses. From native Joule heating to significant improvements in MCAD geometry handling mesh and solution processing lead to productivity gains for Icepak. These improvements will enable thermal engineers to solve complex system-level problems with faster turn-around-times.

Ansys 2021 R2: What’s New in Ansys Speos
The new features of Ansys Speos in our latest release Ansys 2021 R2 continue to speed up optical simulation development time by introducing powerful new modeling visualization and lidar features accelerating your time to market. Highlights include productivity enhancements that allow you to perform 20X faster meshing and increase simulation speed by 6X and new features to accelerate your ADAS and AV simulations.

Ansys 2021 R2: EMA3D Cable Update: Faster EMC Solving for Electronic Devices
Ansys EMA3D Cable is a robust electromagnetic compatibility (EMC) cable modeling solution for small electronic devices and large complex platforms. EMA3D Cable has recently been updated to include new features to accurately model features within electronics enclosures and to interact more seamlessly with other Ansys Electronics tools such as Ansys HFSS and Ansys SIwave.

📁 文件列表/
└─📁 Ansys.Products.2021.R2.Win64-SSQ/
├─📄 Ansys.Products.2021R2.Local.Help.Win64.iso
├─📄 ANSYS2021R2WINX64Disk1.iso
├─📄 ANSYS2021R2WINX64Disk2.iso
├─📄 ANSYS2021R2WINX64Disk3.iso
├─📄 zchecksums.sfv
└─📁 _SolidSQUAD
/
├─📄 readmelocalcrackssq.txt
└─📄 _SolidSQUAD
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