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有限元电磁场仿真-ANSYS Electromagnetics Suite-2020R2-英文-[Windows]

HFSS 2020 R2

What\s New in ANSYS Electronics Desktop 2020 R2

General Electronics Desktop
l New loopback address option to improve reliability of local solves when connecting and
disconnecting with VPN
l Support for Microsoft MPI
l Official release of Dynamic Surface Resolution meshing
l Ability to export field overlay plots to Ensight
l Improved workflows for mesh links between designs
l Support for lighting of field overlay plots
l New object-oriented property scripting (Beta)
l Granta Producers Materials Data library now includes:
l Common Rogers laminates with frequency-dependent models
l Materials with temperature-dependent properties
l Ability to search materials in Granta libraries using keyword

HFSS
l 3D Component Antenna Array: Direct Matrix Solver Option
l 5G SAR standards toolkit
l Multipaction solution:
l Auto-breakdown level calculation
l Charged particle visualization
l Official release
l Broadband HFSS Meshing: Maximum parallel frequencies setting
l HFSS SBR+ Near field analysis and plot overlay
l Series Resistance-Inductance-Capacitance (RLC) Element
l New Molex Antenna 3D Component library
l Complex material definitions for layered impedance boundary conditions
l Support for circuit ports with domain solver
l Dynamic scheduling of distributed discrete sweeps
l Solver Improvements:
l Improved mesh adaption for models with circuit ports
l Improved performance of mixed precision distributed matrix
l UV sine space periodic unit cell scanning (Beta)
l Conductor-Dielectric contact between IE regions (Beta)
HFSS 3D Layout
l HFSS 3D Components: Native support
l HFSS Auto-solution setup with Fast HFSS simulation mode
l Broadband HFSS Meshing: Maximum parallel frequencies setting
l GDS based designs: Improved workflow and capacity
l Circuit element definitions via netlist or schematic
l Dynamic scheduling of distributed discrete sweeps
l Solver Improvements:
l Improved mesh adaption for models with circuit ports
l Improved performance of mixed precision distributed matrix
l HFSS auto-extents improvement for enhanced performance
l Point-based RLC circuit components

Maxwell
l Temperature dependent core loss calculations
l Distributed domain decomposition in 3D magnetostatic

l Harmonic force interpolation for improved ERP waterfall diagrams
l Harmonic force export to third-party formats
l Support for python control programs in 2D and 3D transient
l Workflow improvements for RMxprt general machine type
l Support for temperature feedback on impedance boundaries in 3D eddy
l Improved partial mesh and simulation from full rotational model (Beta)
l Electric machine toolkit enhancements new machine types
l Support for Y connections in 3D transient
l New ECE ROM model for induction machines
l Shared memory multiprocessing in 2D transient
l Support for GPU in distributed 3D eddy frequency sweeps
l Option for user to override parameters in RMxprt
l Enhancements to Maxwell 3D Transient solver based on A-Phi (Beta)
l Ability to create efficiency maps in Maxwell from RMxprt results
Icepak
l Enhancements to meshing workflows reliability and efficiency
l Ability to import external mesh on objects
l Support for mechanical data and package models through 3D Layout
l New concurrent meshing to distribute mesh regions
l Support for rotated PCBs with EM loss coupling
l Ability to import EXCML in Electronics Desktop
l Support for non-uniform material properties
l New PCB and Solar Calculator toolkits
l Support for non-uniform save intervals in transient

Mechanical (Beta)
l Improved data link between Mechanical and EM designs
l Ability to map HTC from Icepak
l Support for shell elements and EM Loss mapping on sheets
l New frictionless plane and cylindrical support for modal
l Enhanced EM Loss support including scaling and offset
Q3D Extractor
l Ability to plot fields on non-model objects for CG

Circuit
l SPISim technology:
l Included in Electronics Enterprise and SIwave licensing
l IEEE 802.3bj and 802.3bs COM and USB compliance checking
l IBIS-AMI model generation and inspection
l Improved workflow for creating reports in the spectral domain
l New damping algorithm for improved DC and transient convergence
l Piecewise linear diode model for power electronics
l Snapback diode model for ESD simulation
l Type I II and III compensator models
l Schematic support for PSPICE VSWITCH models
l New script command to add dynamic links
EMIT (Beta)
l Significant workflow and usability improvements
l Ability to save components to libraries
Twin Builder
Export and Deployment Enhancements
l Easily validate digital twins with Ansys Twin Deployer
l Generate images from deployed twins
l Native support for Twin Builder solver on Linux
l Export co-simulation FMU 2.0 (tool-coupling FMU)
l Export Twin Builder model for Fluent
l Simplified cross-platform (Linux) twin generation for Modelica models
Modelica Enhancements
l Improved behavior for Modelica connector and connection lines
l Syntax check for Modelica models and libraries
l Encryption/password protection for Modelica models
l Modelica workflow enhancements
l Linux support for add-on libraries
Battery and EV Verticalization
l New EV Powertrain library
l Enhancements to Battery Wizard

Enhancements to ROM Builder and 3D Visualization
l Support for vector data visualization
l Visualize snapshot after import in Check tab
l Visualize displacement field
l Define cutting plane and zone selection
l Improved Static Rom Builder selection algorithm
l Support for export snapshots at outputs in Dynamic ROM Builder
l Comparison of results with 3D visualization
l Standalone ROM Point Viewer
New ROM Types in Twin Builder
l New Response Surface ROM
Apps for Creating ROM
l Dynamic ROM Builder: Fluent Mechanical
l Static ROM Builder: Fluent Mechanical
UI and Performance Enhancements
l New Output & Traces dialog box for quick plotting
l Parameter Selection dialog box for sub-sheets
l Page Port copy-paste enhancements
l SdbCtrl data access in scripts
l Performance improvements for script execution
l Support for Super Large FMU (>4GB)
l Support for new Fluent file format (cas.h5)

Crack 破解方法 破解文件在字幕区:

1. Do not install ANSYS License Manager 2020R2!
   Uninstall (if exist) previous versions of ANSYS Electronics
 
2. Install ANSYS Electronics 2020 R2 Win64 
   When asked for licensing select “I have a new license file” > Next
   and browse to “ansyslmd.lic” in crack folder
 
3. Overwrite original  
   (at setup by default C:\\Program Files\\AnsysEM) with cracked one
 
4. If you have environment variable ANSYSLIC_DIR make sure that it points
   to \\Shared Files\\Licensing
   (at setup by default C:\\Program Files\\AnsysEM\\Shared Files\\Licensing )
 
5. REBOOT!
 
6. Enjoy
 

感谢ldlolev (Power User)的提醒,按照如下方法添加环境变量可以解决启动的问题
系统环境变量新建一个项ANSYS_EM_DONOT_PRELOAD_3DDRIVER_DLL,变量值设成1

📁 文件列表/
├─📁 ANSYS Electronics Suite 2020 R2 (x64)/
│ ├─📄 Ansys.Electronics.2020.R2.Win64.iso
│ └─📄 Ansys.Electronics.MCAD.Translators.2020.R2.Win64.iso
└─📄 Crack.rar

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