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有限元电磁场仿真-ANSYS Electromagnetics Suite-2020R1-英文-[Windows]

HFSS 2020 R1 破解见字幕区

This release introduces the ANSYS Electronics Pro Premium Enterprise products a portfolio that
enables broad feature sets with progressively greater capabilities at each level. This portfolio
allows ANSYS customers to progress from system circuit and 2D extraction to 3D FEM and
advanced multi-physics as their simulation needs demand.
General Electronics Desktop
l New Electronics Pro Premium Enterprise product licensing.
l ANSYS Cloud workflow improvements including new machine configurations.
l Official release of Tau Flex meshing.
HFSS
l SBR+ Creeping Wave physics for installed antenna modeling.
l Enhanced workflow for Antenna Array DDM with 3D Components (Beta).
l Template Projects and 3D Components for EMI/EMC applications.
l Selective object and face storage for FEM 3D Fields.
l Overlay of near field contour plots in modeler window.
l H field and Poynting vector export for near field data.
l Face Coordinate System on SBR+ lightweight geometry.
l Circuit elements in 3D Components.
l Parameterized SBR+ antenna components.
l Accuracy control for Integral Equation solver.
l Characteristic mode coefficients from HFSS-IE CMA solver.
l Enhanced lumped port solver for low frequency results (Beta).
l Enhanced adaptive meshing routine for Hybrid full-wave solver (Beta).
l Next generation Iterative Solver (Beta).
l Optimized solver performance for circuit port only simulations (Beta).
HFSS 3D Layout
l Native support for HFSS 3D Components (Beta).
l Improved capacity and usability of ECADXplorer (Beta).
l Support for multi-zone PCB designs (Beta).
l Distributed region solves for HFSS Regions in SIwave.
l Field plots for SIwave DC solutions.
l Support for surface roughness in Icepak two-way coupling.
l Enhanced lumped port solver for low frequency results (Beta).
l Optimized solver performance for circuit port only simulations (Beta).
SIwave
l New EMI Xplorer integrated workflow for EMI design rule checking.
l Support for spatially dependent stack-ups.
l Ability to launch CMA from the SIwave user interface.
l Stackup wizard usability enhancements.
l Advanced coupling detection for SYZ solve (Beta).
l Thermal coupling using Icepak in Electronics Desktop (Beta).
Maxwell
l Ability to include windings in 3D Components.
l Volumetric harmonic force coupling with ANSYS Mechanical.
l Multi-level series and parallel grouping for L and R in Eddy solutions.
l New partial mesh and simulation from full rotational machine model (Beta).
l Support for Litz wire modeling in Eddy solvers.
l Support for object-based harmonic force with multi-slice 2D models.
l New field plots of harmonic force for Transient solutions.
l Ability to plot demagnetization coefficient for Magnetic solutions.
l Electric machine toolkit enhancements new machine types.
l New Maxwell 3D Transient solver based on A-Phi (Beta).
l Updated Granta Materials Data for Simulation: core loss coefficients added.
Icepak
l Commercial release of Transient Thermal solution type.
l Now available on ANSYS Cloud for HPC solutions.
l Part-by-part meshing for efficient simulation of conduction-only models (beta).
l Lightweight geometry for imported STL objects.
l Ability to create parameters for Fan Heatsink and PCB components.
l Visualization of mapped EM Loss from HFSS 3D Layout.
l PCB component workflow improvements.
l New Moving Reference frame for simulation of fans.
l Support for automation through toolkits.
Mechanical (Beta)
l Support for 3D Component creation and use.
Q3D Extractor
l New ANSYS Prime Remeshing feature (Beta).
l Solver performance and robustness improvements.
Circuit
l Frequency variable change from F to Freq consistent with HFSS.
l New option for Duty Cycle in spread spectrum clock components.
l Improved DC accuracy of S-parameter state-space fitting.
l Enhanced PSPICE model support.
EMIT (Beta)
l Auto-place of components and other usability enhancements.
l New 5G Tx/Rx library models for both User Equipment and base Stations.
l Enhanced workflows for coupling configuration and viewing.
Twin Builder
Digital Twin/Export
l Number of enhancements to make export workflow more stable and improve performance.
l Support for Encryption/Decryption.
l Ability to store large FMUs as external files outside the project.
ROMs
l Enhanced Static ROM builder Interface.
l General ROM Viewer.
l New engine for Dynamic ROM Builder.
l Apps for easier ROM generation.
Solver and Performance Improvements
l Number of enhancements and bug fixes.
l Support HDF5 export format for both Twin Builder and Twin SDK.
l Input for data acceleration for Datapairs.
Modelica Enhancements
l Diagram Viewer for sub-systems to explore internal structure.
l Ability to rename Modelica model after cloning.
l General usability and performance enhancements.
l Dynamic Plot update capacity/performance improvements.
l Change Intrinsic Var F to "Freq" in Twin Builder.
Electrification Toolkits
l Number of enhancements in ECM toolkit.
l Examples for Induction Motor Drive system.

【Crack】
1. Do not install ANSYS License Manager 2020R1!

   Uninstall (if exist) previous versions of ANSYS Electronics
 
2. Install ANSYS Electronics 2020 R1 Win64 
   When asked for licensing select "I have a new license file" > Next
   and browse to "ansyslmd.lic" in crack folder
 
3. Overwrite original "AnsysEM program folder" 
   (at setup by default C:\\Program Files\\AnsysEM) with cracked one

远程使用的小伙伴如果遇到license问题可以试着在license文件每一行行末增加 TS_OK

📁 文件列表/
├─📄 Ansys.Electronics.2020R1.Win64_DownLoadLy.iR.iso
└─📄 Crack.rar

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